HUAWEI PURA 70 PRO PLUS dan NOTHING CMF PHONE 1 ?

	PRODUK 1	PRODUK 2
	HUAWEI HUAWEI PURA 70 PRO PLUS	NOTHING NOTHING CMF PHONE 1
VERSI
Diumumkan	April 2024	July 2024
Tanggal rilis	April 2024	July 2024
JARINGAN
Teknologi	5G	5G
PERANGKAT
Dimensi	162.6 x 75.1 x 8.4 mm (6.40 x 2.96 x 0.33 di dalam)	164.0 x 77.0 x 8.2
Berat	220 (G7.76 oz)	197 g or 202 (G6.95 oz)
Kartu SIM
Desain	13MP	16MP (1080p@30fps)
Lainnya	IP68 tahan debu/air	User-replaceable back cover ------ IP52, dust and splash resistant
LAYAR
langfront.Type	LTPO OLED,1B warna,HDR,120Hz,	AMOLED,120Hz,HDR10+,
Ukuran	6.8 inci	6.67 inci
Resolusi	1260 x 2844 piksel	1080 x 2400 piksel
Perlindungan	Kunlun Glass

PLATFORM
Sistem operasi	HarmonyOS 4.2	Android 14
Chipset	Kirin 9010 (7 nm)	Mediatek Dimensity 7300 (4 nm)
Prosesor	Octa-core (1x2.3 GHz Taishan Big & 3x2.18 GHz Taishan Mid & 4x1.55 GHz Cortex-A510)	Octa-core (4x2.5 GHz Cortex-A78 & 4x2.0 GHz Cortex-A55)
GPU		Mali-G615 MC2
MEMORI
Slot kartu	❌	microSDXC
Internal & RAM	512GB 16GB RAM or 1TB 16GB RAM	128GB 6GB RAM or 128GB 8GB RAM or 256GB 8GB RAM
KAMERA
Utama	50 MP (f/1.4-f/4.0) (Laser Auto Focus)(Optical Image Stabilization) + 48 MP (3.5x optical zoom) + 12.5 MP (ultrawide)	50 MP (f/1.8) + 2 MP (depth)
SUARA
Loudspeaker	Yes, with stereo speakers	✔️
Jack 3,5 mm	❌	❌
KONEKTIVITAS
Wifi	pita ganda,Wi-Fi Langsung,	pita ganda
Bluetooth	5.2	5.3
GPS	✔️	✔️
NFC	✔️	❌
Radio	❌	❌
USB	USB Type-C 3.1, DisplayPort 1.2	USB Tipe-C
KARAKTERISTIK
Sensor	Fingerprint (under display, optical), accelerometer, proximity, gyro, compass, color spectrum, BDS Satellite Calling and Message	Sidik jari (di bawah tampilan,optik),akselerometer,kedekatan,kompas,
Berbagai	Fast Charging 100W, Fast wireless charging 80W, Reverse wireless charging 20W, Reverse wired charging 18W	Pengisian cepat 33W,Pengisian daya terbalik 5W,
BATERAI
Tipe	5050 mAh	5000 mAh

Apa perbedaan antara HUAWEI PURA 70 PRO PLUS dan NOTHING CMF PHONE 1 ?

HUAWEI

HUAWEI PURA 70 PRO PLUS

NOTHING

NOTHING CMF PHONE 1